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UVA 1100*1100 (45mil)

















1. Features
• AlGaN/InGaN-based thin-film vertical LED chip technology
• High brightness and efficiency
• Excellent thermal management capability with metal alloy support
• Compatible with silver epoxy, solder paste, solder preform.
• Long operation lifetime
• Lambertian radiation

2. Applications
• UV curing system
• UV inspection system
• Industrial machine vision system
• Photolithography system

3. Mechanical Dimensions
• Chip size : 1100 x 1100 ±50μm
• P-N Junction size : 1052 x 1052 ±50μm
• Total thickness : 130 ±20μm
• Bond pad : 160 ±20μm
• Backside metallization with Gold
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產品規格  22124ca38b8dc1ead2eaa7aa09c9ea45.gif


Part Number
Chip Size Wavelength Forward Current Optical Power Forward Voltage
LEUV-V618A6

1100x1100um

365nm

500mA 680~880mW 3.5~4.0V
 1000mA 1240~1640mW 3.8-4.3V
LEUV-V623A6

1100x1100um

385nm

500mA 780mW~940mW 3.25~3.6V
 1000mA 1440~1760mW 3.55-3.95V
LEUV-V624A6

1100x1100um

395nm

500mA 820~1000mW 3.15~3.6V
1000mA 1520~1880mW 3.45~3.95V
LEUV-V625A6

1100x1100um

405nm

500mA 780~980mW 3.25~3.6V
1000mA 1440~1840mW 3.55~3.95V
CHIP-UVA 1152161