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UVA 1700*1700 (68mil)

















1. Features
• AlGaN/InGaN-based thin-film vertical LED chip technology
• High brightness and efficiency
• Excellent thermal management capability with metal alloy support
• Compatible with silver epoxy, solder paste, solder preform, or eutectic attach
• Long operation lifetime
• Lambertian radiation

2. Applications
• UV curing system
• UV inspection system
• Industrial machine vision system
• Photolithography system

3. Mechanical Dimensions
• Chip size : 1700 x 1700 ±50μm
• P-N Junction size : 1650 x 1650 ±50μm
• Total thickness : 130 ±20μm
• Bond pad : 160 ±20μm
• Backside metallization with AuSn eutectic layer
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產品規格  22124ca38b8dc1ead2eaa7aa09c9ea45.gif


Part Number
Chip Size Wavelength Forward Current Optical Power Forward Voltage
LEUV-V741A6 1700x1700um 365nm 500mA 700~820mW 3.2~3.7V
LEUV-V742A6 1700x1700um 385nm 500mA 700~1000mW 3.0~3.6V
LEUV-V743A6 1700x1700um 395nm 500mA 700~1000mW 3.0~3.6V
LEUV-V744A6 1700x1700um 405nm 500mA
700~1000mW 3.0~3.6V
CHIP-UVA 1152183